Inside the box
Follow the original photos, service guides and design files for each machine. Every entry states the model it covers and what still needs checking.
Back to the machine catalogueNVIDIA
A photographed disassembly of the NVIDIA DGX Spark 4TB is available.
Disassembly photos cover the enclosure, cooling assembly and circuit boards.
Measure the chassis and map the photographed layers before replacing the schematic geometry.
NVIDIA
DGX Station is a platform record; its partner systems have different enclosures and cooling layouts.
Architecture and partner information; not a chassis teardown. Earlier DGX Station A100 material does not describe this GB300 generation.
Choose a specific OEM chassis before constructing a physical exploded model. See the Dell, MSI, ASUS, Gigabyte and Supermicro records.
Dell publishes an illustrated service manual for the FCT6263.
Component diagram and procedures for covers, graphics cards, SSDs and the power supply. This is service documentation, not a complete chip-level teardown.
Match the installed display card and storage configuration when mapping the model.
Hands-on teardown photos, CT views and a teardown video are available for Ryzen AI Halo.
Shows bottom-cover access, the removable M.2 2280 SSD and the extracted compute assembly. The reviewers left one thermal plate in place.
Published July 6, 2026; linked as a video reference, without a frame-by-frame geometry review.
Reconstruct the measured enclosure and cooling layers; the published photos do not supply complete CAD.
Aetina
Aetina lists a manual for the AIP-FR68-A2 bare system. The catalogue describes a configured Qualcomm system.
The downloads list a March 2, 2026 user manual. The PDF contents and the configured accelerator layout have not been verified.
Inspect the A2 manual and confirm chassis revision, accelerator placement and cooling for the dual Cloud AI 100 Ultra configuration.
Arduino
Arduino provides board schematics and downloadable CAD/STEP resources.
Official resource index includes schematics, CAD, STEP, pinout and a block diagram. These are board design resources, not an enclosure teardown.
Download link published by Arduino. Archive geometry has not yet been inspected or incorporated into the viewer.
Inspect the STEP assembly and its licensing, then convert a suitable revision to a lightweight web model.
No public teardown or service manual for this announced system was located in this research pass.
Obtain an exact OEM model, production chassis reference and internal photographs. Ryzen AI Halo mini-PC teardowns describe a different machine.
ASUS
A hands-on disassembly shows ASUS's own board and cooling assembly.
Photos show the board removed from the case, a pair of cooling fans and M.2 2242 storage access.
Map the GX10 photographs to measured geometry; do not copy the Spark enclosure or assume identical board placement.
Dell provides a component diagram and illustrated SSD access procedures for the FCM1253.
Illustrates the rubber base, bottom cover, SSD and chassis. The manual also links SSD removal and replacement procedures.
Cooling and chip placement still need deeper internal photography; the service diagram treats the chassis assembly as one unit.
A setup/user guide was found, but no verified internal teardown or illustrated service procedure was located.
Official support index currently located in research; its user-guide listing does not establish internal component positions.
Find the Nano G1n service or recycling-disassembly guide, or obtain exact-model internal photos. Other GB10 boxes are not layout evidence for this HP.
Lenovo
Lenovo publishes removal and replacement videos for the PGX machine types.
Manufacturer service-video collection. Linked as repair evidence; individual video frames have not yet been mapped to 3D geometry.
Review each component video and match the 30KL/30KM revision before modeling the assembly.
Acer
A hands-on review includes photos with the cover removed and the storage area exposed.
Shows the metal structural plate and M.2 2242 storage area. This is partial access, not a full component teardown.
Find a complete board and cooling disassembly before reconstructing all internal layers.
GIGABYTE
A photographed disassembly covers this Gigabyte GB10 machine.
Photos document the internal speakers, shielding and M.2 2242 SSD access as part of the disassembly.
Use the ATOM-specific images to locate its speakers, shielding, board and cooling layers.
MSI
MSI describes the EdgeXpert cooling design, but a complete photographed teardown was not located.
MSI describes a vapor chamber, heat pipes and heatsink. This vendor explanation is not an independent teardown or a measured layout.
Obtain board-side photos and component positions for EdgeXpert itself.
ASUS lists an English Pro ET900N G3 user manual on its support site.
Manufacturer manual listing located. Direct PDF inspection remains outstanding; this entry is not counted as a verified teardown.
Retrieve and inspect the original manual's hardware setup and internal layout illustrations before using them for the model.
Hands-on review and thermal coverage show the opened WS300 and its cooling hardware.
Opened-chassis review; useful for assembly layout, not a complete disassembly guide.
Additional cooling-system coverage for the reviewed unit.
Check the production configuration and measurements before building the liquid-cooling and board geometry.
HP
No verified teardown or illustrated hardware service manual for ZGX Fury was located.
Support index to recheck for hardware documentation; a BIOS guide is not teardown evidence.
Find the ZGX Fury G1n hardware service guide or exact-model internal photos. Z8 Fury is a different workstation.
GIGABYTE
Detailed open-chassis photos are available from an ISC trade-show unit.
Photographed with the liquid-cooling assembly removed for exhibition. Useful board views; not proof of the complete shipping cooling layout.
Verify the production revision and obtain views with the cooling system installed.
Supermicro
Supermicro publishes model-specific maintenance and component installation documentation.
Official manual chapters cover system access, storage, cooling, GPU and power supply. This catalogue's tower/5U system is the subject of the manual.
Match the ARS-511GD-NB-LCC revision and installed GPU options when reconstructing the enclosure.
Exxact
An owner has published internal photos of an Exxact GB300 system using an MSI WS300 chassis.
Owner-attributed photos in an AI-assisted write-up. Exact Valence SKU is unconfirmed; use the images as a lead, not verified assembly or upgrade instructions.
Confirm that the owner's chassis and revision match Valence SKU VWS-158270643 before treating these photos as exact-model evidence.
HP's model-specific support index lists the Z8 Fury G6i Maintenance and Service Guide.
Select the 10.29 MB Maintenance and Service Guide in HP's document list. Guide availability is confirmed; its full PDF has not yet been inspected for modeling.
Open the guide from HP's support page and match the selected GPU configuration before extracting its layout.
Lenovo
Lenovo provides a hardware maintenance manual and component replacement documentation for P7.
Official guide links Hardware Maintenance Manual and CRU replacement sections. Confirm the applicable edition and machine type before using its diagrams.
Match the machine type and installed RTX PRO option; chassis documentation does not establish the layout of every GPU configuration.
Framework
Framework Desktop has official replacement guides, an early iFixit teardown and open mechanical documentation.
OEM guides cover the mainboard, heatsink, fan, power supply, case and storage.
An early-access disassembly. Check any mechanical differences against production repair guides.
Mainboard documentation and selected case/tile CAD under CC BY 4.0. Not a complete exploded model of every internal component.
Use production service guides to check the early teardown, and inspect which published CAD parts cover the intended model.
MINISFORUM
A hands-on internal hardware tour shows both sides of the MS-S1 Max assembly.
Shows the sliding chassis, cooling assembly, storage, internal PSU and expansion area from both sides.
Measure the chassis and align the photographed cooling, storage and power sections with the schematic.
HP publishes an illustrated parts catalogue and removal/replacement procedures for the Z2 Mini G1a.
Official HP-hosted service guide with an illustrated parts catalogue and component removal sections.
Extract the correct G1a layout and confirm the configuration; G1i documents describe a different platform.
Apple now publishes a repair manual specifically for the M5 Max and M5 Ultra Mac Studio.
Generation-specific manual published September 21, 2026; its index lists exploded parts, fan, PSU, logic board and housing procedures. Individual assembly diagrams have not yet been mapped into the 3D model.
Inspect the M5 Ultra component variants and diagrams before reconstructing its geometry. The 2025 manual remains a different generation.
Apple publishes a 2025 exploded view and repair procedures explicitly covering M3 Ultra.
Exploded assembly and part list distinguish M3 Ultra and M4 Max logic boards, SSD modules and covers.
Procedures cover the power supply, internal frame, SSD modules, logic board, fan and housing.
Use the M3 Ultra part variants and dimensions when reconstructing the assembly; keep M4 Max and M5 Ultra configurations distinct.
